waiyabondeingu method

摘要

In a bonding method for bonding with a wire a first bonding point and then a second bonding point, a capillary that carries the wire is moved in a direction which is opposite from the first bonding point at the same time that an ultrasonic vibration is applied to the capillary during bonding to the second bonding point. Such a movement of the opposite direction can occur 10-20 ms after the application of the ultrasonic vibration at the second bonding point.