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LAND STRUCTURE, ITS PRODUCTION METHOD, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE USING LAND STRUCTURE
LAND STRUCTURE, ITS PRODUCTION METHOD, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE USING LAND STRUCTURE
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机译:土地结构,其生产方法和使用土地结构的电子组件安装结构
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摘要
PROBLEM TO BE SOLVED: To solve the problem that a part where a land touches a solder bump is susceptible to cracking along the circumferential face part of the land and bonding reliability is lowered at the bonding part. ;SOLUTION: In a land structure provided on the mounting face 5A of a printed wiring board 5 and connected with the large number of electrodes 3 of a CSP 1 through solder bumps 4, a part F for bonding the solder bump 4 to the land 8 by causing the solder of the solder bump 4 bite at least on the circumferential face part 8A of the land 8 comprising a conductor pattern formed on the mounting face 5A. The solder biting part F makes the end face part 8b side of the land 8 wider than the bottom face part 8a thereof so that the circumferential face part 8A of the land 8 spreads reverse conically.;COPYRIGHT: (C)2001,JPO
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