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Electronic Component, Production Method of Electronic Component, Mounted Structure of Electronic Component, and Evaluation Method of Electronic Component

机译:电子零件,电子零件的制造方法,电子零件的安装结构以及电子零件的评价方法

摘要

Electronic components, and a terminal electrode electrically connected to the circuit board through the elementary body and the conductive particles having at least one plane. Terminal electrodes are formed on the plane of the body. The plane of the body with the reference surface, and the height from the terminal electrode of the projected area of ​​a plane of the outer surface opposite to the circuit board, the plane of the terminal electrode is not less than a value obtained by subtracting a diameter of a conductive particle from the maximum value of the height the ratio of the projected area in the plane of the outer surface opposite to the circuit board in the area, is set to 10% or more. ; Electronic components, the projected area, the mounting structure, the flattening, Evaluation
机译:电子元件和通过基本体和具有至少一个平面的导电颗粒电连接到电路板的端子电极。端子电极形成在主体的平面上。带有基准面的物体的平面,以及与电路板相对的外表面的平面的投影区域距端子电极的高度,该端子电极的平面不少于从该高度的最大值中减去导电性粒子的直径,将该区域中与电路基板相对的外表面的平面中的投影面积的比例设为该面积的10%以上。 ;电子零件,投影面积,安装结构,展平,评估

著录项

  • 公开/公告号KR100904159B1

    专利类型

  • 公开/公告日2009-06-23

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20070031628

  • 申请日2007-03-30

  • 分类号H01B5/16;H01G2/06;H01R11/01;H05K3/32;

  • 国家 KR

  • 入库时间 2022-08-21 19:11:52

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