AQUEOUS DISPERSANT FOR CHEMICAL MECHANICAL POLISHING USED IN MANUFACTURE OF SEMICONDUCTOR DEVICE AND CHEMICAL MECHANICAL POLISHING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an aqueous dispersant for chemical mechanical polishing which can form sufficiently flattened good damascene wiring and is used in the manufacture of a semiconductor device and a chemical mechanical polishing method using the dispersant. ;SOLUTION: The aqueous dispersant has such a feature that, when a copper film, a barrier metal film, and an insulating film are polished under the same condition, the ratio (RCu/RBM) of the polishing speed RCu of the copper film to that RBM of the barrier metal film becomes 0.5-2 and the ratio (RCu/RIn) of the polishing speed RCu of the copper film to that RIn of the insulating film becomes 0.5-2. The chemical mechanical polishing method uses the aqueous dispersant.;COPYRIGHT: (C)2001,JPO