AQUEOUS DISPERSANT FOR CHEMICAL AND MECHANICAL POLISHING BARRIER METAL LAYER PROVIDED ON SUBSTRATE FOR ELECTRO-OPTICAL DISPLAY, KIT FOR PREPARING AQUEOUS DISPERSANT FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an aqueous dispersant for chemical mechanical polishing which can suppress variations in in-plane planarity of a surface to be polished, while ensuring in-plane uniformity of polishing speed in a process for chemical and mechanical polishing a barrier metal layer provided on a substrate for electro-optical display, and to provide a kit for preparing the aqueous dispersant for chemical mechanical polishing, and to provide a chemical mechanical polishing method that uses the aqueous dispersant for chemical mechanical polishing.;SOLUTION: The aqueous dispersant for chemical mechanical polishing contains (A) an organic acid, (B) a water-soluble polymer, (C) an organic agent, and (D) abrasive grains, and the mass ratio (A):(B) of the (A) amino acid to the (B) surfactant is in the range of 1:0.01-1:3.;COPYRIGHT: (C)2008,JPO&INPIT