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INTEGRATED CIRCUIT MOUNTING BOARD FOR INTEGRATED CIRCUIT LIFE TEST

机译:综合电路寿命测试的综合电路板

摘要

PROBLEM TO BE SOLVED: To provide an integrated circuit mounting board for integrated circuit life test capable of withstanding high temperatures and preventing it from being damaged due to brittleness.;SOLUTION: This integrated circuit mounting board for integrated circuit life test is so formed that, in order to test the life of wiring of a film forming an integrated circuit, a terminal 1a of a socket 1 allowing a pin terminal T provided in a package of an integrated circuit IC to be inserted and connected thereto is allowed to abut on one end 4a of a number of pieces of wiring 4 formed on an insulation film 3 on the surface of a rust-resistant metal sheet 2, the socket 1 is installed on the metal sheet 2, the other end 4b of a number of pieces of wiring 4 formed on the insulation film 3 on the surface of the metal sheet 2 is formed so as to be allowed to be inserted into the outer surface from the inner surface of a door 10 of a constant temperature oven 9 allowing the temperature to vary and allowed to be projected, the other end 4b of a number of wirings 4 formed on the insulation film 3 of the metal sheet 2 projected to the outer surface of the door 10 is inserted and connected to a cable socket 7 connected to the end of a cable 6 connected to a life tester 5.;COPYRIGHT: (C)2001,JPO
机译:要解决的问题:提供一种用于集成电路寿命测试的集成电路安装板,该集成电路安装板能够承受高温并防止由于脆性而损坏。;解决方案:这种集成电路寿命测试的集成电路安装板的结构如下:为了测试形成集成电路的膜的配线的寿命,允许插座1的端子1a的一端抵接,该插座1允许将设置在集成电路IC的封装中的引脚端子T插入并连接至该插座。在防锈金属板2的表面上的绝缘膜3上形成多条配线4a的图4a,在金属板2上安装插座1,多条配线4的另一端4b形成在金属板2的表面上的绝缘膜3上的绝缘膜3被形成为允许从恒温炉9的门10的内表面插入外表面,从而使温度达到改变并允许突出,形成在金属板2的绝缘膜3上的多条布线4的另一端4b的突出到门10的外表面上的另一端4b插入并连接到电缆插座7,该电缆插座7的一端连接到寿命测试仪5的电缆6的图片;版权所有:(C)2001,JPO

著录项

  • 公开/公告号JP2001174508A

    专利类型

  • 公开/公告日2001-06-29

    原文格式PDF

  • 申请/专利权人 KAN ELECTRONICS CO LTD;

    申请/专利号JP19990360500

  • 发明设计人 UKAI HIDEO;

    申请日1999-12-20

  • 分类号G01R31/26;

  • 国家 JP

  • 入库时间 2022-08-22 01:30:09

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