首页> 外国专利> AMORPHOUS SILICON THIN FILM AND MANUFACTURING METHOD OF POLYSILICON THIN FILM USING THE SAME

AMORPHOUS SILICON THIN FILM AND MANUFACTURING METHOD OF POLYSILICON THIN FILM USING THE SAME

机译:非晶硅薄膜及使用该薄膜的多晶硅薄膜的制造方法

摘要

PROBLEM TO BE SOLVED: To prevent changes of crystallinity of an a-Si thin film against ELA irradiation energy density by specifying the a-Si thin film suitable for the ELA. ;SOLUTION: A heat treatment of an a-Si thin film, whose thickness is 40 nm-80 nm and whose optical band gap is not less than 1.80 eV and not more than 1.88 eV, is carried out in a temperature not lower than 400°C but not higher than 600°C in nitrogen or inert gas atmosphere so that dehydrogenation can be realized, and that the optical band gap can be not less than 1.68 eV but not more than 1.72 eV. Thus, the change of the crystallinity of the a-Si thin film with respect to ELA energy density is made small, and thus the crystallinity of a poly-Si thin film can be controlled easily.;COPYRIGHT: (C)2001,JPO
机译:要解决的问题:通过指定适用于ELA的a-Si薄膜来防止a-Si薄膜的结晶度随ELA辐射能量密度的变化。 ;解决方案:在不低于400°C的温度下对厚度为40 nm-80 nm且光学带隙不小于1.80 eV和不大于1.88 eV的a-Si薄膜进行热处理在氮气或惰性气体气氛中,在室温下加热;但不高于600℃,从而可以实现脱氢,并且光学带隙可以不小于1.68eV但不大于1.72eV。因此,可以减小a-Si薄膜的结晶度相对于ELA能量密度的变化,从而可以容易地控制多晶硅薄膜的结晶度。;版权所有:(C)2001,JPO

著录项

  • 公开/公告号JP2001110724A

    专利类型

  • 公开/公告日2001-04-20

    原文格式PDF

  • 申请/专利权人 MATSUSHITA ELECTRIC IND CO LTD;

    申请/专利号JP19990285550

  • 发明设计人 TSUTSU HIROSHI;SAKAI MASAHIRO;

    申请日1999-10-06

  • 分类号H01L21/20;H01L21/324;H01L29/786;H01L21/336;

  • 国家 JP

  • 入库时间 2022-08-22 01:29:50

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