首页> 外国专利> BGA COMPONENT MOUNTING TERMINAL, BGA COMPONENT MOUNTING STRUCTURE AND METHOD FOR MOUNTING BGA COMPONENT

BGA COMPONENT MOUNTING TERMINAL, BGA COMPONENT MOUNTING STRUCTURE AND METHOD FOR MOUNTING BGA COMPONENT

机译:BGA组件的安装端子,BGA组件的安装结构和安装方法

摘要

PROBLEM TO BE SOLVED: To solve the problems in prior art where in mounting a BGA component on a wiring board, the mounting deviation of the connection terminal occurred at the position of a mounting pad of the wiring board because of the spherical connection terminals of the BGA component. ;SOLUTION: A BGA component mounting terminal 1 is made of a conductive material and formed like a bell jar which has a head 1a dish-shaped for mounting a connection terminal of the BGA component and a leg 1b with a through- hole 1c piercing the leg 1b.;COPYRIGHT: (C)2001,JPO
机译:要解决的问题:为了解决现有技术中在将BGA组件安装在布线板上时存在的问题,由于BGA组件的球形连接端子,在接线板的安装垫的位置出现了连接端子的安装偏差。 BGA组件。 ;解决方案:BGA组件安装端子1由导电材料制成,并形成类似于钟形罩的形状,其具有一个碟形的头1a,用于安装BGA组件的连接端子,以及带有通孔1c的支脚1b,该通孔1c第1b条;;版权:(C)2001,日本特许厅

著录项

  • 公开/公告号JP2001111205A

    专利类型

  • 公开/公告日2001-04-20

    原文格式PDF

  • 申请/专利权人 OKI ELECTRIC IND CO LTD;

    申请/专利号JP19990282313

  • 发明设计人 UCHIDA KIYOSHI;

    申请日1999-10-04

  • 分类号H05K3/34;H01R4/02;

  • 国家 JP

  • 入库时间 2022-08-22 01:29:46

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号