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Cad process surface mounting. calculation of volume of solder for circuits in performance bga

机译：CAD工艺表面安装。性能bga中用于电路的焊料量的计算

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Khatsko Sergei; Karpenko Alexei; Хацько Сергей; Карпенко Алексей;
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年度 2010
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原文格式 PDF
正文语种 uk
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1. Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB) [J] . Depiver Joshua A., Mallik Sabuj, Amalu Emeka H. Journal of Electronic Materials . 2021,第1期

机译：用于在印刷电路板（PCB）上焊接的球栅阵列（BGA）中焊点的热机械可靠性的有效焊料
2. Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies [J] . T. Kangasvieri, O. Nousiainen, J. Putaala, Microelectronics & Reliability . 2006,第8期

机译：LTCC / PWB组件中带有塑料芯焊球的BGA焊点的可靠性和RF性能
3. Effect of Solder Joint Arrangements on BGA Lead-Free Reliability During Cooling Stage of Reflow Soldering Process [J] . Lau C.-S., Abdullah M. Z., Ani F. C. Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2012,第12期

机译：回流焊接工艺冷却阶段中焊点排列方式对BGA无铅可靠性的影响
4. PERFORMANCE EVALUATIONS OF SURFACE FINISH AND SOLDER ALLOY CONFIGURATIONS FOR BGA SOLDER JOINT RELIABILITY [C] . Hugh Roberts, Sven Lamprecht, Christian Sebald, 14th annual Pan Pacific microelectronics symposium and tabletop exhibition . 2009

机译：BGA焊接接头可靠性的表面处理和焊接合金配置的性能评估
5. Modeling and process optimization of solder paste stencil printing for micro-BGA and fine pitch surface mount assembly [D] . Pan, Jianbiao 2000

机译：微型BGA和细间距表面贴装组件的锡膏模版印刷建模和工艺优化
6. Optimal Hot-Dipped Tinning Process Routine for the Fabrication of Solderable Sn Coatings on Circuit Lead Frames [O] . Ting Yin, Nan Xiang, Guangxin Wang, 2020

机译：在电路引线框架上制造可焊锡涂层的最佳热浸镀锡工艺程序
7. Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Manufacturing Process of PWBs for the Substrate of MCM and Bare Chip Mounting. Build-up Structure Pinted Circuit Board. [O] . Yutaka TSUKADA 1994

机译：特殊文章：近期MCM和裸LSI芯片安装的趋势。用于MCM和裸芯片安装基板的PWB的制造过程。积聚结构呈胶质电路板。
8. Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance;Circuit World [R] . Vianco, P. T. 1998

机译：表面处理概述及其在印刷电路板可焊性和焊点性能中的作用;电路世界

Cad process surface mounting. calculation of volume of solder for circuits in performance bga

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