METHOD OF MANUFACTURING PRINTED WIRING BOARD USING CONDUCTIVE PROJECTION FOR INTERLAYER CONNECTION, MULTILAYER PRINTED WIRING BOARD USING THE SAME, AND PRINTED WIRING BOARD AND MULTILAYERED PRINTED WIRING BOARD OBTAINED BY THE METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing printed wiring board using conductive projection for interlayer connection, by which a printed wiring board having high surface planarity can be manufactured without deteriorating the positional accuracy nor warping the board and interlayer connection can be performed surely, a multilayer printed wiring board using the method, and a printed wiring board and a multilayered printed wiring board obtained by the method.;SOLUTION: This method of manufacturing printed wiring board comprises a step of preparing a first wiring member having conductive projections on its surface (1), a step of preparing a second wiring member having a metal layer or a wiring group on at least its surface (2), and a step of filling up the spaces among the conductive projections with a thermosetting insulating resin maintained in an A-stage state (3). The method also comprises a step of integrating the first wiring member carrying the insulating layer on its surface with the second wiring member, so that the wiring members may be electrically connected to each other through the conductive projections by heating and pressurizing the members (4).;COPYRIGHT: (C)2001,JPO