HEAT INSULATING STRUCTURE, SEMICONDUCTOR MICROACTUATOR USING THE SAME, SEMICONDUCTOR MICROVALVE, AND SEMICONDUCTOR MICRORELAY

摘要

PROBLEM TO BE SOLVED: To provide a heat insulating structure having a high heat insulating efficiency and manufactured through simple processes, a semiconductor microactuator using the same, a semiconductor microvalve, and a semiconductor microrelay. ;SOLUTION: Four outwardly extending flexible areas 2 joined to a central moving element 5 are joined to a semiconductor substrate 3 via heat insulating areas 7 made from a heat insulating material such as polyimide or fluororesin, the semiconductor substrate 3 serving as a frame. The heat insulating areas 7 are provided within the thickness of the flexible area 2 between the semiconductor substrate 3 and the flexible area 2 in such a way as to be about as thick as the flexible area 2. When the flexible areas 2 are heated by heating means 6 consisting of impurity diffusion resistances or the like provided on the surfaces of the flexible areas 2, the flexible areas 2 flex because of a difference in thermal expansion from thin films 4 of aluminum or nickel provided on the flexible areas 2, and the movable element 5 is displaced.;COPYRIGHT: (C)2000,JPO