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PRODUCTION OF THICK LOW IRON LOSS GRAIN ORIENTED SILICON STEEL PLATE

机译:生产厚薄的低铁晶粒取向硅钢板

摘要

PROBLEM TO BE SOLVED: To irradiate the surface of a thick grain oriented silicon steel plate of =0.30 mm plate thickness with a laser beam and to improve the iron loss characteristics therein. SOLUTION: In the method for producing a grain oriented silicon steel plate in which a grain oriented silicon steel plate having =0.3 mm plate thickness is irradiated with a laser beam and magnetic domain fractionization is executed, the cumulative irradiating energy density at the optional point on a scan line in the laser beam irradiation is controlled to the range from (69t+44) to (104t+66)(mJ/mm2) to the plate thickness (mm), and moreover, the power density of the laser beam is controlled to =(168t+106) kW/mm2. The irradiating diameter of the laser beam is preferably controlled to 6 to 10 mm major axis and 0.25 to 0.35 mm minor axis in the case of an oval and to 0.4 to 0.5 mm in the case of a circle.
机译:解决的问题:用激光束照射板厚> = 0.30 mm的厚晶粒取向硅钢板的表面,并改善其中的铁损特性。解决方案:在晶粒取向硅钢板的制造方法中,对厚度大于等于0.3 mm的晶粒取向硅钢板进行激光束照射,并进行磁畴分级分离,在任意点累积辐射能密度将激光束在扫描线上的照射控制在从(69t + 44)至(104t + 66)(mJ / mm2)至板厚(mm)的范围内,并且,激光束的功率密度为控制到<=(168t + 106)kW / mm2。最好将激光束的照射直径控制为椭圆形时的长轴6〜10mm,短轴0.25〜0.35mm,圆形时的0.4mm〜0.5mm。

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