PRODUCTION OF THICK LOW IRON LOSS GRAIN ORIENTED SILICON STEEL PLATE

摘要

PROBLEM TO BE SOLVED: To form physical grooves on a thick grain oriented silicon steel plate having ≥0.30 mm plate thickness and to improve the iron loss characteristics therein. ;SOLUTION: In the method for producing a low iron loss grain oriented silicon steel plate in which grooves are formed on a finish-annealed grain oriented silicon steel plate of ≥0.3 mm plate thickness, and magnetic domain fractionization is executed, in the case fine crystal grains are formed directly below the grooves, to the plate thickness t (μm), the groove depth is controlled to the range from (0.06t-5) to (0.06t+5) μm, and moreover, in the case grooves which do not accompany fine crystal grains are formed, the groove depth is controlled to the range from (0.11t-5) to (0.11t+5) μm. At this time, the groove width is preferably controlled to ≤200 μm.;COPYRIGHT: (C)2000,JPO