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WET PROCESSING METHODS FOR THE MANUFACTURE OF ELECTRONIC COMPONENTS USING SEQUENTIAL CHEMICAL PROCESSING
WET PROCESSING METHODS FOR THE MANUFACTURE OF ELECTRONIC COMPONENTS USING SEQUENTIAL CHEMICAL PROCESSING
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机译:顺序化学处理制造电子元件的湿法处理方法
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摘要
The present invention is directed to wet processing methods for the manufacture of electronic component precursors, such as semiconductor wafers used in integrated circuits. More specifically, this invention relates to methods, for example, prediffusion cleaning, stripping, and etching of electronic component precursors using sequential chemical processing techniques.
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