首页> 外国专利> A non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath

A non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath

机译:非氰化物黄铜镀浴和使用该非氰化物黄铜镀浴制造具有黄铜层的金属箔的方法

摘要

The present invention provides a non-cyanide brass plating bath composition containing copper, zinc, metal polyphosphate, and orthophosphate, with the proviso that the composition does not contain cyanide. The present invention also provides a method of making metallic foil having a brass layer including the steps of providing a metallic foil; contacting the metallic foil with a non-cyanide brass plating bath containing copper, zinc, metal polyphosphate, and orthophosphate, with the proviso that the brass plating bath does not contain cyanide; applying a current to the brass plating bath; and recovering the metallic foil having a brass layer.
机译:本发明提供了一种含有铜,锌,金属多磷酸盐和正磷酸盐的无氰化物黄铜镀浴组合物,条件是该组合物不含氰化物。本发明还提供一种制造具有黄铜层的金属箔的方法,该方法包括以下步骤:提供金属箔。使金属箔与包含铜,锌,金属多磷酸盐和正磷酸盐的非氰化物黄铜电镀液接触,条件是黄铜电镀液不含氰化物;向黄铜镀液施加电流;回收具有黄铜层的金属箔。

著录项

  • 公开/公告号EP0790332B1

    专利类型

  • 公开/公告日2001-07-18

    原文格式PDF

  • 申请/专利权人 GA TEK INC;

    申请/专利号EP19970300854

  • 发明设计人 AMEEN THOMAS J.;ORLOFF GREGORY L.;

    申请日1997-02-10

  • 分类号C25D3/58;

  • 国家 EP

  • 入库时间 2022-08-22 01:17:00

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