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Method for making microporous silicone resins with narrow pore-size distributions

机译:具有窄孔径分布的微孔有机硅树脂的制备方法

摘要

The present invention refers to a silicone resin where at least 5 percent of silicon atoms are substituted with at least one triarylsilylalkylene group described by formula Ar3Si(CH2)p- and at least 45 percent of silicon atoms are substituted with at least one hydrogen atom, where each Ar is an independently selected aryl group and p=2 to 20, to a method making same and to a method for preparing a microporous silicone resin which can be used to form low dielectric constant films useful for electrical insulating coatings on electronic devices comprising heating the above silicone resin in an inert atmosphere at a temperature sufficient to effect thermolysis of the triarylsilylalkylene groups from the silicon atoms and to microporous silicone resins obtainable thereby. .
机译:本发明涉及一种有机硅树脂,其中至少5%的硅原子被至少一个式Ar 3 Si(CH 2 p -和至少45%的硅原子被至少一个氢原子取代,其中每个Ar是独立选择的芳基,p = 2至20,制备可用于形成用于电子设备上的电绝缘涂层的低介电常数膜的微孔有机硅树脂,包括在惰性气氛中在足以实现三芳基甲硅烷基亚烷基从硅原子热解的温度下加热上述有机硅树脂,并且由此可获得的微孔硅氧烷树脂。 。

著录项

  • 公开/公告号EP1078948A1

    专利类型

  • 公开/公告日2001-02-28

    原文格式PDF

  • 申请/专利权人 DOW CORNING CORPORATION;

    申请/专利号EP20000117066

  • 发明设计人 ZHONG BIANXIAO;

    申请日2000-08-09

  • 分类号C08G77/50;

  • 国家 EP

  • 入库时间 2022-08-22 01:16:04

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