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METHOD FOR MAKING MICROPOROUS SILICONE RESINS WITH NARROW PORE-SIZE DISTRIBUTIONS

机译:具有微孔尺寸分布的微孔硅树脂的制造方法

摘要

A method for preparing a microporous siliconeresin which can be used to form low dielectric constantfilms useful for electrical insulating coatings onelectronic devices comprising (A) contacting ahydridosilicon containing resin with an alkenyltri-arylsilane in the presence of a platinum group metal-containing hydrosilation catalyst effecting formation ofa silicon resin where at least 5 percent of silicon atomsare substituted with at least one triarylsilylalkylenegroup and 45 percent of silicon atoms are substitutedwith at least one hydrogen atom and (B) heating thesilicon resin of step (A) in an inert atmosphere at atemperature sufficient to effect thermolysis of thetriarylsilylalkylene groups from the silicon atoms.
机译:一种微孔硅酮的制备方法可以用来形成低介电常数的树脂用于电绝缘涂层的薄膜电子设备,包括(A)与含氢化硅树脂的烯基三铂族金属存在下的芳基硅烷含氢硅化催化剂的形成硅树脂中至少有5%的硅原子被至少一个三芳基甲硅烷基亚烷基取代基和45%的硅原子被取代(B)加热至少一个氢原子步骤(A)的硅树脂在惰性气氛中于温度足以影响其热分解三芳基甲硅烷基亚烷基由硅原子组成。

著录项

  • 公开/公告号SG92733A1

    专利类型

  • 公开/公告日2002-11-19

    原文格式PDF

  • 申请/专利权人 DOW CORNING CORPORATION;

    申请/专利号SG20000004637

  • 发明设计人 ZHONG BIANXIAO;

    申请日2000-08-18

  • 分类号C08G77/50;C08G77/06;C08G77/12;C08G77/20;

  • 国家 SG

  • 入库时间 2022-08-22 00:00:55

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