PACKAGE STACK VIA A BOTTOM LEADED PLASTIC PACKAGING OF A HIGHLY INTEGRATED CIRCUIT

摘要

PURPOSE: A package stack via a bottom leaded plastic(BLP) packaging of a highly integrated circuit is provided to have leads of upper and lower BLP's electrically connected to a solder land of a board, by a soldering process carried out in mounting stacked BLP packages without a lead connection, on the board. CONSTITUTION: A package stack via a bottom leaded plastic(BLP) packaging of a highly integrated circuit comprises a lower BLP, an upper BLP and an adhesive material. In the lower BLP, an external power supply connection lead exposed through a bottom surface is exposed to the outside of a mold body. An upper surface of the upper BLP is adhered to an upper surface of the lower BLP. A bottom lead exposed upward is extended and curved to reach a position of the lead of the lower BLP. The adhesive material is intervened between the upper and lower BLP's to connect mold bodies of the upper and lower BLP's.