CVD DIAMOND COATED SUBSTRATE FOR POLISHING PAD CONDITIONING HEAD AND METHOD FOR MAKING SAME

摘要

Flat substrate polishing and a polishing pad conditioning head for a chemical mechanical planarization apparatus to increase the durability of the polishing pad used to planarize or polish the in processing semiconductor wafers oxide and the metal layer and provide a uniform polishing than that of the polishing pad life doubling thereby. The polishing pad conditioning head 24 is surrounded by a suitable substrate 26, the gapan diamond particles uniformly distributed on the surface of 26, 28 and the diamond particles (28) CVD diamond (30) the substrate ( to be coupled to the surface of 26) comprises the diamond particles 28 and the substrate (the CVD diamond (30) growth on 26).