首页> 外国专利> FLEXIBLE WIRING BOARD METHOD OF MANUFACTURING FLEXIBLE WIRING BOARD AND DISPLAY DEVICE EQUIPPED WITH FLEXIBLE WIRING BOARD

FLEXIBLE WIRING BOARD METHOD OF MANUFACTURING FLEXIBLE WIRING BOARD AND DISPLAY DEVICE EQUIPPED WITH FLEXIBLE WIRING BOARD

机译:制造柔性配线板的柔性配线板方法以及配备有该柔性配线板的显示装置

摘要

PURPOSE: A flexible wiring board is provided to have small size, to improve the reliability in connection with a bump electrode of a semiconductor chip as well as to prevent deformation of a connection terminal mounted on a film base. CONSTITUTION: A flexible wiring board(41) has structure of mounting one or all of electric components such as a semiconductor chip(43) and a chip component(44) in COF(Chip On Film) manner. A film base(42) includes a film made of polyimide having thickness of 25-38 micrometers, and a wire supported by the film. The wire has plural output wires and input wires(46). The wire is coated with metals having a low melting point such as tin. The semiconductor chip and the chip components are mounted on each specific region in the center of the film base. The semiconductor chip is mounted on the lower face of the film base without using a device hole in a semiconductor chip mounting region. Therefore, deformation of a connection terminal on the film base is prevented.
机译:用途:提供一种挠性电路板,以使其具有较小的尺寸,以提高与半导体芯片的凸点电极的连接可靠性,并防止安装在膜基底上的连接端子变形。构成:挠性电路板(41)具有以COF(膜上芯片)方式安装诸如半导体芯片(43)和芯片组件(44)之类的电子组件中的一个或全部的结构。膜基材(42)包括厚度为25-38微米的由聚酰亚胺制成的膜以及由该膜支撑的线。导线具有多根输出导线和输入导线(46)。电线被锡等低熔点的金属所覆盖。半导体芯片和芯片组件被安装在膜基底的中央的每个特定区域上。半导体芯片被安装在膜基底的下表面上,而无需在半导体芯片安装区域中使用装置孔。因此,防止了膜基材上的连接端子的变形。

著录项

  • 公开/公告号KR20010078040A

    专利类型

  • 公开/公告日2001-08-20

    原文格式PDF

  • 申请/专利号KR20010003501

  • 发明设计人 SAITO HIROKAZ;

    申请日2001-01-22

  • 分类号G02F1/1345;

  • 国家 KR

  • 入库时间 2022-08-22 01:13:00

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