Method for manufacturing a semiconductor device and analysis apparatus for parallel analysis using F-Ivy

摘要

The present invention relates to a method for manufacturing a semiconductor device and an apparatus for manufacturing the same, which perform analysis using Fivy.;The manufacturing method of the present invention comprises the steps of: after milling the predetermined film using F-Ivy, grasping the image of the cross section of the area exposed by the milling; And filling the selectable material according to the predetermined film in the region where the milling is made.;The manufacturing apparatus of the present invention comprises: an analysis means capable of grasping an image of a cross section of a region exposed by the milling by milling a predetermined film; And a nozzle for filling a material selectable according to the predetermined film in the region where the milling is made.;Therefore, the wafer used in the analysis is continuously used in a subsequent process, thereby minimizing the loss of the wafer, thereby improving productivity due to the manufacture of the semiconductor device, and also promptly taking measures for the presence or absence of the semiconductor device. There is an effect of improving the reliability of the manufacture of.