Wafer Probing System and Wafer Probing Needle Calibrating Method Using Those

摘要

The present invention wafer probing equipment and relates to a needle calibration method for wafer inspection using the same, according to the wafer probe probing devices a plurality of which needles are equipped with the installed probe card for testing a wafer, the wafer chuck the wafer is placed, the wafer stifle the chuck horizontal and chuck the wafer to move up and down in the stand, are provided on the chuck the wafer pedestal is provided on the chuck needle chuck, the wafer in contact with the plurality of needles individually stand camera to identify the positions of the plurality of needle , and receives data that indicates the position of the needle by the camera and a controller for controlling the needle chuck and the wafer chuck moved, the needle chuck the wafer by providing a shield wire surrounding the signal line, and the signal line having conductivity sword A needle can be individually brought into contact.