首页> 外国专利> Bonding two microstructured plastics workpieces together, comprises introducing a plastics-dissolving organic solvent into a groove between the workpieces

Bonding two microstructured plastics workpieces together, comprises introducing a plastics-dissolving organic solvent into a groove between the workpieces

机译:将两个微结构化的塑料工件粘合在一起,包括将可溶解塑料的有机溶剂引入到工件之间的凹槽中

摘要

Bonding workpieces together, where at least one has microstructures with a smallest dimension of less than 1 mm, and at least one has a groove containing plastics bonding surface, comprising contacting the workpieces, introducing a plastics-dissolving organic solvent into the grooves, and allowing residual solvent between the workpieces to escape, or removing it under vacuum or pressure, is new.
机译:将工件粘合在一起,其中至少一个具有最小尺寸小于1毫米的微观结构,至少一个具有包含塑料粘合表面的凹槽,包括与工件接触,将可溶解塑料的有机溶剂引入凹槽中并允许工件之间残留的溶剂要在真空或压力下逸出或除去,这是新的。

著录项

  • 公开/公告号DE19922075A1

    专利类型

  • 公开/公告日2000-11-16

    原文格式PDF

  • 申请/专利权人 INSTITUT FUER MIKROTECHNIK MAINZ GMBH;

    申请/专利号DE1999122075

  • 发明设计人 WEBER LUTZ;

    申请日1999-05-14

  • 分类号C09J5/00;B32B3/10;B32B31/24;B29C65/00;

  • 国家 DE

  • 入库时间 2022-08-22 01:10:30

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