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Producing cutting die for a packaging industry, comprises providing a laser cutting device for the introduction of grooves, and providing a workpiece in which a pattern groove are introduced for receiving steel lines
Producing cutting die for a packaging industry, comprises providing a laser cutting device for the introduction of grooves, and providing a workpiece in which a pattern groove are introduced for receiving steel lines
The method for producing cutting die for packaging industry, comprises providing a laser cutting device (10) for the introduction of grooves, providing a workpiece (14) in which a pattern groove (16) are introduced for receiving steel lines, introducing a free section (18) into the workpiece outside of a workpiece surface provided for the pattern with the laser cutting device, measuring a flank (19) of the free section, evaluating the measurement results, and adjusting a parameter of the laser cutting device dependent on the evaluation of the measurement results. The method for producing cutting die for packaging industry, comprises providing a laser cutting device (10) for the introduction of grooves, providing a workpiece (14) in which a pattern groove (16) are introduced for receiving steel lines, introducing a free section (18) into the workpiece outside of a workpiece surface provided for the pattern with the laser cutting device, measuring a flank (19) of the free section, evaluating the measurement results, adjusting a parameter of the laser cutting device dependent on the evaluation of the measurement results, and introducing the grooves into the workpiece with the laser cutting device. The free section comprises two flanks parallel to each other, where both flanks are measured parallel to each other. The free section comprises other two flanks parallel to each other, where the flanks pass orthogonally, parallel to both other flanks, which are measured in tactile and optical. A course of the flanks is measured perpendicular to the surface of the workpiece. The laser cutting device is adjusted in dependent on the measurement of a focus position and/or a power. A feed rate is adjusted between the laser cutting device and the workpiece. Other free section is introduced in other area of the workpiece. An independent claim is included for a device for producing cutting die for packaging industry.
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