首页>
外国专利>
Production of semiconductor device comprises forming dielectric material on component structure and filling chambers between structures, chemical-mechanical polishing and forming fluid insulating material on dielectric
Production of semiconductor device comprises forming dielectric material on component structure and filling chambers between structures, chemical-mechanical polishing and forming fluid insulating material on dielectric
Production of a semiconductor device comprises forming a dielectric material (112) on a component structure (102) and filling the chambers between the structures; chemical-mechanical polishing the dielectric material and forming a fluid insulating material (118) on the dielectric material to produce a planar surface.
展开▼