首页>
外国专利>
Chip component, useful for a memory chip stack, has chip contact pads connected through an adhesive dielectric strip to mounting element conductor lines and solder balls connected to mounting element contact vias
Chip component, useful for a memory chip stack, has chip contact pads connected through an adhesive dielectric strip to mounting element conductor lines and solder balls connected to mounting element contact vias
A semiconductor chip component, comprising chip contact pads connected through an adhesive dielectric strip to mounting element conductor lines and solder balls connected to mounting element contact vias, is new. A semiconductor chip component comprises: (a) a chip mounting element with contact vias connected to conductor lines; (b) a chip with contact pads; (c) a dielectric strip element for adhesively bonding the chip onto the mounting element; (d) a conductor unit for electrically connecting the chip contact pads and the conductor lines; and (e) solder balls provided on the mounting element and respectively aligned and connected with associated contact vias in the mounting element. An Independent claim is also included for a semiconductor chip stack with upper and lower chip components as described above.
展开▼