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DEVICE AND METHOD FOR ELECTRICALLY OR THERMALLY COUPLING TO THE BACKSIDES OF INTEGRATED CIRCUIT DICE IN CHIP-ON-BOARD APPLICATIONS
DEVICE AND METHOD FOR ELECTRICALLY OR THERMALLY COUPLING TO THE BACKSIDES OF INTEGRATED CIRCUIT DICE IN CHIP-ON-BOARD APPLICATIONS
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机译:在板上应用中用于电学或热学耦合到集成电路模的背面的装置和方法
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摘要
An inventive printed circuit board for chip-on-board applications has a ground plane that is externally exposed through apertures in any overlying layers in the board so the backside surface of a bare integrated circuit die can be directly attached to the ground plane using a silver-filled epoxy. As a result, heat is conducted away from the die through the ground plane. Also, a substrate bias voltage can be supplied to the backside surface of the die through the ground plane to eliminate the need for an internal substrate bias to the die, and to eliminate the need for a substrate bias voltage bond pad on the front-side surface of the die.
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