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Combination test structures for in-situ measurements during fabrication of semiconductor devices

机译:半导体器件制造过程中用于现场测量的组合测试结构

摘要

A first test structure (40) is used to measure both the gate resistance/linewidth and transistor performance. A gate line (42) crosses a moat region (44) with source (48) and drain (50) regions formed on either side of the gate line (42). The gate line (42) is connected to four probe pads (52) in an H configuration for accurate linewidth measurements. A second test structure (70) may be used alone or in conjunction with the first test structure. A single gate line (72) crosses a moat region (74) several times. This allows both capacitance and gate gate-resistance measurements with the same test structure and for more accurate TLD measurement.
机译:第一测试结构(40)用于测量栅极电阻/线宽和晶体管性能。栅极线(42)与沟纹区域(44)交叉,并且在栅极线(42)的任一侧上形成源极(48)和漏极(50)区域。栅极线(42)以H配置连接到四个探针垫(52),以进行精确的线宽测量。第二测试结构(70)可以单独使用或与第一测试结构结合使用。一条栅极线(72)穿过a沟区域(74)数次。这允许使用相同的测试结构进行电容和栅极栅极电阻测量,并实现更精确的TLD测量。

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