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IC device under test temperature control fixture

机译:被测IC器件温控治具

摘要

A temperature control fixture for an integrated circuit under test which provides for heating or cooling of the back side of the integrated circuit while it is being tested by contacts and electrical leads applied to the opposite lead side thereof. A test housing defines a sealed test chamber within which a test mounting is provided for mounting the integrated circuit under test. The test mounting is connected to a plurality of test lines for conducting test signals between the lead side of the integrated circuit and a test instrument external to the test apparatus. The integrated circuit is mounted on the test mounting to expose the back side thereof to a flow of a heat transfer medium in the sealed test chamber to provide for cooling or heating thereof. An observation window in the test housing enables observation of the back side of device during testing.
机译:一种用于被测集成电路的温度控制装置,该装置在对集成电路背面进行加热或冷却时,可以通过接触点和施加在其相对引线面上的电引线对其进行测试。测试壳体限定了密封的测试室,在测试室中提供了用于安装被测集成电路的测试支架。测试装置连接到多条测试线,用于在集成电路的引线侧和测试设备外部的测试仪器之间传导测试信号。集成电路安装在测试安装架上,以使其背侧暴露于密封的测试腔室中的传热介质流中,以对其进行冷却或加热。通过测试外壳中的观察窗,可以在测试过程中观察设备的背面。

著录项

  • 公开/公告号US6191599B1

    专利类型

  • 公开/公告日2001-02-20

    原文格式PDF

  • 申请/专利权人 INTERNATIONAL BUSINESS MACHINES CORPORATION;

    申请/专利号US19980169073

  • 发明设计人 KEITH C. STEVENS;

    申请日1998-10-09

  • 分类号G01R312/60;

  • 国家 US

  • 入库时间 2022-08-22 01:05:04

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