Solder test device for testing the material composition of joints, has control unit provided for controlling temperature of test section, and indicator device for indicating whether test section exhibits predetermined target temperature

摘要

The device has a test section which is brought in contact with a joint. A heating unit (7) is provided for heating the test section at a temperature between 150 and 300[deg]C. A temperature sensor measures the temperature of the test section. A control unit (11) is provided for controlling the temperature, and an indicator device (9) indicates whether the test section exhibits a predetermined target temperature.