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Determining endpoint in etching processes using principal components analysis of optical emission spectra with thresholding
Determining endpoint in etching processes using principal components analysis of optical emission spectra with thresholding
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机译:使用具有阈值的光发射光谱的主成分分析来确定蚀刻过程中的终点
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摘要
A method is provided for determining an etch endpoint. The method includes collecting intensity data representative of optical emission spectral wavelengths during a plasma etch process. The method further includes analyzing at least a portion of the collected intensity data into at most first and second Principal Components with respective Loadings and corresponding Scores. The method also includes determining the etch endpoint using the respective Loadings and corresponding Scores of the second Principal Component as an indicator for the etch endpoint using thresholding applied to the respective Loadings of the second Principal Component.
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