首页> 外国专利> Poly routing for chip interconnects with minimal impact on chip performance

Poly routing for chip interconnects with minimal impact on chip performance

机译:芯片互连的多边形布线,对芯片性能的影响最小

摘要

Methods for using the polysilicon layer to route the cells in the ASIC are disclosed. The poly layer of an IC chip is used for routing chip interconnects with minimal impact on the chip performance by selecting nets in the IC chip based on a predetermined or a desired qualification. A maximum allowable length of the poly layer to be used for chip interconnects is determined based on the intended technology of the chip. A filtering algorithm filters the netlist to provide a set of candidate nets that are suitable for poly layer routing based on the predetermined or desired qualification. A routing tool routes the selected nets that have been selected by the filtering algorithm by using the poly layer. Some of the poly layer routings are further rejected by a post processing step.
机译:公开了使用多晶硅层来路由ASIC中的单元的方法。通过基于预定或期望的条件在IC芯片中选择网络,IC芯片的多晶硅层可用于路由芯片互连,并且对芯片性能的影响最小。基于芯片的预期技术来确定用于芯片互连的多晶硅层的最大允许长度。过滤算法对网表进行过滤,以基于预定或所需的限定条件提供一组适合于多层路由的候选网。路由工具使用poly层路由已由过滤算法选择的选定网络。某些多层路由选择会进一步被后处理步骤拒绝。

著录项

  • 公开/公告号US6240542B1

    专利类型

  • 公开/公告日2001-05-29

    原文格式PDF

  • 申请/专利权人 LSI LOGIC CORPORATION;

    申请/专利号US19980115464

  • 发明设计人 RAJIV KAPUR;

    申请日1998-07-14

  • 分类号G06F175/00;

  • 国家 US

  • 入库时间 2022-08-22 01:04:15

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