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Methods of forming integrated circuitry methods of forming thin film transistors, integrated circuitry and thin film transistors
Methods of forming integrated circuitry methods of forming thin film transistors, integrated circuitry and thin film transistors
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机译:形成集成电路的方法形成薄膜晶体管的方法,集成电路和薄膜晶体管
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摘要
An electrical interconnection method includes: a) providing two conductive layers separated by an insulating material on a semiconductor wafer; b) etching the conductive layers and insulating material to define and outwardly expose a sidewall of each conductive layer; c) depositing an electrically conductive material over the etched conductive layers and their respective sidewalls; and d) anisotropically a etching the conductive material to define an electrically conductive sidewall link electrically interconnecting the two conductive layers. Such is utilizable to make thin film transistors and other circuitry.
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