The lead/read frame and its manufacturing method for the plastic package and uses the said lead/read frame the plastic package

摘要

PURPOSE: To improve the heat radiation of a lead frame for plastic packages, reduce the thermal expansion difference from an Si chip and avoid peeling and cracking the resin by cutting out a stripe-like thin metal sheet composed of two specified metals alternately laminated and disposed like a unidirectional stripe in the plane of the sheet. ;CONSTITUTION: The title lead frame is made by cutting out a stripe-like thin metal sheet composed of Fe-Ni alloys 2 and Cu-contained metals 3 alternately laminated and disposed like a unidirectional stripe in the plane of the sheet. The alloy 2 may use an alloy having a low thermal expansion coefficient such as 42% Ni alloy or 35-37% Ni alloy called 'Invar', and the metal 3 may use Cu or Cu alloy such as Cu-Pb alloys and Cu-Sn alloys having a thermal conductivity as good as Cu's thermal conductivity of 393W/mK+10%. As for a LOC structured plastic package, inner leads 5 are cut out parallel to stripes and bus bars 7 are cut out parallel to the stripes.;COPYRIGHT: (C)1996,JPO