HIGHLY INTEGRATED MULTILAYER CIRCUIT MODULE PROVIDED WITH BURIED DRIVEN ELEMENT AND CERAMIC SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To manufacture a highly matched multilayer circuit module using a plurality of ceramic substrates, and also to realize matching of such modules.;SOLUTION: Integrated circuit elements are installed on one or two surface layers of a circuit module, and the multilayer structure is divided into three matching regions: inner interconnection matching region, basic driven element matching region, and high frequency driven element matching region. An interconnection layer is formed in the inner interconnection matching region, and an integrated circuit is connected to the interconnection layer. The basic driven element matching region includes a capacitor, resistance, and inductor layers. A filter, coupler, and balance-to-unbalance resistor converter are formed in the high frequency driven element matching region. The elements are separated by the separated ground surface to prevent the electromagnetic interference. Standard input/output contacts are formed on the surface of the bottom layer to turn the circuit module to a moduled element.;COPYRIGHT: (C)2002,JPO