METHOD FOR PACKAGING SEMICONDUCTOR CHIP ONTO SUBSTRATE AND SEMICONDUCTOR DEVICE SUITABLE FOR PACKAGING TO SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To easily connect a semiconductor chip to an external circuit, and to improve a yield in production.;SOLUTION: A method for manufacturing a semiconductor device includes a process where a semiconductor chip 1 having a pad packaging surface 10 with a bonding pad 11 is provided, an inside projection 2 is formed on a bonding surface, and a conductor 5 is formed on a pad bonding surface. The conductor 5 has an anchor section 500 electrically connected to the inside projection 2 for surrounding, and a contact section 502 offset from the anchor section 500 for suitably connecting to a substrate 7.;COPYRIGHT: (C)2002,JPO