首页> 外国专利> RUTHENIUM COMPOUND FOR CHEMICAL VAPOR DEPOSITION AND METHOD FOR CHEMICAL VAPOR DEPOSITION OF RUTHENIUM THIN FILM AND RUTHENIUM COMPOUND THIN FILM

RUTHENIUM COMPOUND FOR CHEMICAL VAPOR DEPOSITION AND METHOD FOR CHEMICAL VAPOR DEPOSITION OF RUTHENIUM THIN FILM AND RUTHENIUM COMPOUND THIN FILM

机译:用于化学气相沉积的钌化合物以及用于钌薄膜和钌复合薄膜的化学气相沉积的方法

摘要

PROBLEM TO BE SOLVED: To provide raw material compounds which are useful for producing ruthenium or ruthenium compound thin films by a chemical vapor deposition(CVD) method, can be decomposed only by a heating treatment in an inert gas, even when oxygen gas is not introduced into the CVD reaction system, and can prevent the doping of oxygen into a ground substrate, wherein the doping of the oxygen gas affects the characteristics of electric or electronic parts having the thin films, and from which the thin films having good properties can be produced.;SOLUTION: The dicarbonyltrimethylsilylruthenium compound, tricarbonylruthenium compound or tetracarbonylbis(trimethylsilyl)ruthenium of the general formula 1, 2 or 3 (X is a straight chain/branched alkenyl or cycloalkenyl, straight chain/branched alkadienyl or cycloalkadienyl, cycloalkatrienyl or cycloalkatrienyl having one to four double bonds), which are used for producing ruthenium thin films or ruthenium compound thin films by the CVD method.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:为了提供可用于通过化学气相沉积(CVD)方法生产钌或钌化合物薄膜的原料化合物,即使不使用氧气,也只能通过在惰性气体中进行热处理才能分解引入到CVD反应系统中,并且可以防止氧气掺杂到研磨的基底中,其中氧气的掺杂影响具有薄膜的电气或电子部件的特性,并且可以从中获得具有良好性能的薄膜解决方案:通式为1、2或3的二羰基三甲基硅烷基钌化合物,三羰基钌化合物或四羰基双(三甲基硅烷基)钌一到四个双键),用于通过CVD生产钌薄膜或钌化合物薄膜方法;版权:(C)2002,日本特许厅

著录项

  • 公开/公告号JP2002212112A

    专利类型

  • 公开/公告日2002-07-31

    原文格式PDF

  • 申请/专利权人 TANAKA KIKINZOKU KOGYO KK;

    申请/专利号JP20010012943

  • 发明设计人 OKAMOTO KOJI;

    申请日2001-01-22

  • 分类号C07C13/23;C07F7/08;C23C16/18;C23C16/40;

  • 国家 JP

  • 入库时间 2022-08-22 00:56:27

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