Sn-Ag-Cu BASE SOLDER FOR ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a high-reliability solder material to which Ge or Se and Sb, etc., are added, in order to improve the oxidation, impact resistance, etc., of the solder which are the drawbacks of the Sn-Ag-Cu-base Pb-free solder material and to provide the solder for electronic apparatus suppressing oxidation and having high reliability.;SOLUTION: This solder contains 1 to 3 mass % Ag, 0.5 to 1.0 mass % Cu, 0.01 to 0.03 mass % Ge or 0.01 to 0.1 mass % Se and has the balance Sn.;COPYRIGHT: (C)2001,JPO