ON-CHIP SIGNAL FILTER WITH BONDING WIRE INDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide a method of realizing an integrated filter which has a high Q-value.;SOLUTION: Using a wire trace and a bonding wire which connect IC bonding pads, an inductive element for an on-chip signal filter (200) is formed. By using the bonding wire and/or the wire trace, different types of filters, including among then, band-pass filter, low-pass filter, high-pass filter, matching filter, and notch filter can be formed by a plurality of methods. Since the bond wire and the wire trace can provide a sufficiently high Q-value, when combined with an on-chip and/or off-chip capacitor, a filter architecture that saves the mounting area of an IC and has high energy efficiency can be realized.;COPYRIGHT: (C)2002,JPO