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METHOD FOR CONTROLLING SWITCHING SPEED OF INSULATED GATE BIPOLAR TRANSISTOR(IGBT) ELEMENT, ITS STRUCTURE AND MANUFACTURING METHOD
METHOD FOR CONTROLLING SWITCHING SPEED OF INSULATED GATE BIPOLAR TRANSISTOR(IGBT) ELEMENT, ITS STRUCTURE AND MANUFACTURING METHOD
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机译:绝缘栅双极晶体管(IGBT)元件的开关速度控制方法,其结构和制造方法
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摘要
PROBLEM TO BE SOLVED: To accelerate switching by shortening a life of a minority carrier in an insulated gate bipolar transistor(IGBT) element.;SOLUTION: The insulated gate bipolar transistor(IGBT) element comprises a p-n-p type bipolar transistor having a p+-type silicon substrate 1 as a collector, an n+-type buffer layer 2 formed on the substrate 1 and having an n--type thin layer 3 on an upper part, and a p-type base region selectively formed on a main surface of the layer 3, an n+-type emitter region formed on a main surface of the base region, an emitter metal formed on the emitter region, and a gate electrode of a polysilicon formed on a gate oxide of a channel region of an upper part of a part surrounded by the p-type base region, n--type epitaxial layer and an n+-type emitter region. The transistor (IGBT) element further comprises a misfit transfer layer formed by a method for doping a germanium(Ge) in the n+-type buffer layer 2 in adjacent interfaces between the layer 2, the substrate 1 and the epitaxial layer 3.;COPYRIGHT: (C)2002,JPO
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