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TRENCH-GATE INSULATED-GATE BIPOLAR TRANSISTORS (IGBTs) AND METHODS OF MANUFACTURE

机译:沟槽栅极绝缘栅双极晶体管(IGBT)及其制造方法

摘要

In a general aspect, method of producing an insulated-gate bipolar transistor (IGBT) device can include forming a termination structure in an inactive region. The inactive region at least partial surround an active region. The method can also include forming a trench extending along a longitudinal axis in the active region. A first mesa can define a first sidewall of the trench, and a second mesa can define a second sidewall of the trench. The first mesa and the second mesa can be parallel with the trench. The method can further include forming, in at least a portion of the first mesa, an active segment of the IGBT device, and, forming, in at least a portion of the second mesa, an inactive segment of the IGBT device.
机译:在一般方面,制造绝缘栅双极晶体管(IGBT)器件的方法可以包括在非活性区域中形成终端结构。无效区域至少部分地围绕有效区域。该方法还可包括在有源区中形成沿着纵轴延伸的沟槽。第一台面可以限定沟槽的第一侧壁,第二台面可以限定沟槽的第二侧壁。第一台面和第二台面可以与沟槽平行。该方法可以进一步包括在第一台面的至少一部分中形成IGBT器件的有源段,以及在第二台面的至少一部分中形成IGBT器件的无源段。

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