首页> 外国专利> JOINING METHOD OF CABLES AND JOINING STRUCTURE OF CABLES AS WELL AS ELECTRICALLY CONNECTING BOX EQUIPPED WITH ITS JOINING STRUCTURE

JOINING METHOD OF CABLES AND JOINING STRUCTURE OF CABLES AS WELL AS ELECTRICALLY CONNECTING BOX EQUIPPED WITH ITS JOINING STRUCTURE

机译:电缆的连接方法,电缆的连接结构以及具有其连接结构的电气接线盒

摘要

PROBLEM TO BE SOLVED: To simplify a junction work and improve a mechanical strength while keeping a high electroconductivity of a junction by joining cables using electroconductive resin.;SOLUTION: This is equipped with a chip arrangement process wherein members W1, W2 mutually electro conductively connected are overlapped at a connecting part and a chip 50 made of insulating resin Q with electroconductive resin P installed at the central part and at least at one side of the overlapped part S, a coating part fusion process wherein a coating part 3 of the overlapped part S is fused with a heating technique such as thermal compression bonding, ultrasonic wave welding or the like and a conductor wire part 1 is made to be exposed after an application of the chip arrangement process, and a chip fusing process wherein after an application of the coating part fusion process, the exposed conductor wire part 1 of the overlapped part S is jointed to counterparts of the both members W1, W2 and an outside of the electroconductive resin P is coated by the insulating resin Q that is fused on the chip 50.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:为了简化连接工作并提高机械强度,同时通过使用导电树脂连接电缆来保持连接的高电导率。解决方案:这具有芯片布置工艺,其中元件W1,W2相互导电连接在连接部分处重叠由绝缘树脂Q制成的芯片50,并且在重叠部分S的中央部分和至少一侧上安装导电树脂P,从而进行芯片50的涂覆部分熔化工艺,其中重叠部分的涂覆部分3 S通过热压接,超声波焊接等加热技术而熔融,在实施了芯片配置工序之后,以及在进行了芯片熔合工序之后,使导体线部1露出。涂覆部分熔化过程中,重叠部分S的裸露导线部分1接合到两个构件W1,W2和导电树脂P的外侧被熔化的绝缘树脂Q涂覆在芯片50上; COPYRIGHT:(C)2002,JPO

著录项

  • 公开/公告号JP2002134244A

    专利类型

  • 公开/公告日2002-05-10

    原文格式PDF

  • 申请/专利权人 YAZAKI CORP;

    申请/专利号JP20000331298

  • 发明设计人 TERADA KATSUAKI;KUBOTA MITSUJI;

    申请日2000-10-30

  • 分类号H01R43/00;H05K3/32;

  • 国家 JP

  • 入库时间 2022-08-22 00:53:58

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