METALLIC MATERIAL, SPUTTERING TARGET MATERIAL FOR THIN FILM DEPOSITION AND THIN FILM

摘要

PROBLEM TO BE SOLVED: To obtain an alloy material in which the improvement of weather resistance and stability and facilitation in a sputtering stage when used as a sputtering target are attained and to obtain a thin film.;SOLUTION: An alloy obtained by incorporating a CuAg alloy obtained by incorporating, by weight, 0.3 to 10.0% Ag into Cu, e.g. with Ti of 0.01 to 5.0% as a corrosion resistance improving material is used as a sputtering material for thin film deposition, and a thin film is produced thereby.;COPYRIGHT: (C)2002,JPO