DECISION METHOD FOR PRECEDING WAFER, DECISION METHOD FOR MEASURING WAFER AND ADJUSTING METHOD FOR NUMBER OF WAFERS

摘要

PROBLEM TO BE SOLVED: To decide a preceding wafer in such a way that a treated result by a treatment process is within a standard regarding most wafers inside a lot.;SOLUTION: On the basis of a treated result by a film deposition process which is performed with reference to the wafers inside the lot before an etching process, the preceding wafer is decided from among the wafers inside the lot, and the etching process is performed to the preceding wafer. A treated result by the etching process which is performed to the preceding wafer is confirmed. The etching process is then performed to other semiconductor wafers other than the preceding wafer from among the wafers inside the lot.;COPYRIGHT: (C)2001,JPO