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Electronic device including at least one chip fixed to a support and a method for manufacturing such a device
Electronic device including at least one chip fixed to a support and a method for manufacturing such a device
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机译:包括至少一个固定在支撑件上的芯片的电子设备及其制造方法
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摘要
The invention aims at the manufacturing of a device having a support associated with at least one microcircuit in the form of a chip, and comprises the replacement of at least one chip having a defect either within it or at its connection to the communication interface; provision is made for: ;pressing the chip to be replaced into the thickness of the support so that the top surface of the chip fits flush with the surface (16a) of the support or is slightly recessed below it and its connection with the communication interface is broken; ;providing an assembly composed of a thin replacement chip.
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机译:本发明的目的在于制造一种具有与芯片形式的至少一个微电路相关联的支撑物的装置,并且包括替换至少一个在其内部或其与通信接口的连接处具有缺陷的芯片。规定:;将待更换的切屑压入支架的厚度,以使切屑的上表面与切屑的表面( 16 B> a I>)齐平。支架或支架下方略微凹陷,并且与通讯接口的连接断开; ;提供由薄替换芯片组成的组件。
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