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Land grid array semiconductor device and method of mounting land grid array semiconductor devices
Land grid array semiconductor device and method of mounting land grid array semiconductor devices
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机译:焊盘栅格阵列半导体器件和安装焊盘栅格阵列半导体器件的方法
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摘要
A main object of the present invention is to provide a land grid array type semiconductor device which has been improved to provide greater positioning accuracy for an external electrode with respect to a mounting substrate. An external electrode is arranged in one surface of a substrate in area array. The external electrode includes an external electrode pad and an external electrode interconnection. The external electrode pad includes a first pad layer formed in a cylinder shape and a second pad layer formed to cover the surface of the first pad layer in a cone shape.
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