首页>
外国专利>
METHODS OF ENGAGING ELECTRICALLY CONDUCTIVE TEST PADS ON A SEMICONDUCTOR SUBSTRATE REMOVABLE ELECTRICAL INTERCONNECT APPARATUSES, ENGAGEMENT PROBES AND REMOVABLE ENGAGEMENT PROBES
METHODS OF ENGAGING ELECTRICALLY CONDUCTIVE TEST PADS ON A SEMICONDUCTOR SUBSTRATE REMOVABLE ELECTRICAL INTERCONNECT APPARATUSES, ENGAGEMENT PROBES AND REMOVABLE ENGAGEMENT PROBES
展开▼
机译:在半导体衬底可移动的电气互连装置,接合问题和可移动的接合问题上接合导电测试垫的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate; b) engaging the grouping of apexes with the single test pad on the semiconductor substrate; and c) sending an electric signal between the grouping of apexes and test pad to evaluate operability of integrated circuitry on the semiconductor substrate. Constructions and methods are disclosed for forming testing apparatus comprising an engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate.
展开▼