Ball grid array package capable of increasing heat-spreading effect and preventing electromagnetic interference

摘要

The present invention proposes a BGA package capable of increasing heat-spreading effect and preventing EMI. The BGA package of the present invention comprises a BGA substrate with a conductive ring formed on the periphery thereof. The BGA substrate has a metal layer electrically connected to the conductive ring. At least an IC chip is arranged on the BGA substrate. A cap capable of conducting both electricity and heat covers over the chip. The periphery of the cap is sealed with the conductive ring. Raise parts formed in the cap contacts with the chip to conduct heat out. Moreover, the cap, the conductive ring, and the metal layer can form a shield of EMI for the chip.