Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin

摘要

A pin standing resin substrate 311 comprises a resin substrate 313 and many pins 301 soldered (HD) to a pin-pad 317A, the resin substrate comprising such as a resin and having a pin-pad 317AP whose diameter of a portion exposed in a main surface 313A is 0.9 to 1.1 mm. The kovar-made pin 301 is previously heat-treated at 700C, whereby Vickers hardness is made Hvaround 150, and the pin has a rod-like portion 301A of a diameter being 0.3 mm and an enlarged diameter portion 301B shaped in disk being 0.60 to 0.70 mm and thickness being 0.15 to 0.20 mm, the enlarged diameter portion being formed at one end of the rod-like portion 301A. This enlarged diameter portion 301B is soldered to the pin-pad.