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Process for promoting adhesion between an inorganic substrate and an organic polymer
Process for promoting adhesion between an inorganic substrate and an organic polymer
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机译:促进无机基材和有机聚合物之间粘附的方法
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摘要
The invention relates to a process, and compositions for its implementation, to promote adhesion between an inorganic substrate and an organic polymer, especially between the copper surfaces of printed circuits for electronic use and a polymer resin, in which an organometallic layer of a dark brown colour, which is very uniform and compact, is deposited on the inorganic substrate by means of treatment in a composition which comprises:;a) a silane or a mixture of functional organic silanes with a structure represented by the following general formula: Y(CH2)nSi(OR)3 where: Y represents a functional organic group, n is a number which has a value between 0 and 3, and R represents a hydrogen atom or any easily hydrolysable group which is capable of releasing an atom of hydrogen;b) an azole compound;;c) an oxygen carrier;;d) an organic or inorganic acid; and preferably;e) a zinc compound.
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